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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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PNP Silicon Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in audio amplifier applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications. * High Current: 1.5 Amps * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die * Available in 12 mm Tape and Reel Use BCP53T1 to order the 7 inch/1000 unit reel. Use BCP53T3 to order the 13 inch/4000 unit reel.
COLLECTOR 2,4
BCP53T1
Motorola Preferred Device
MEDIUM POWER PNP SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT
4
1
BASE 1 EMITTER 3
2 3
CASE 318E-04, STYLE 1 TO-261AA
MAXIMUM RATINGS (TC = 25C unless otherwise noted)
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Total Power Dissipation @ TA = 25C(1) Derate above 25C Operating and Storage Temperature Range Symbol VCEO VCBO VEBO IC PD TJ, Tstg Value - 80 -100 - 5.0 1.5 1.5 12 - 65 to 150 Unit Vdc Vdc Vdc Adc Watts mW/C C
DEVICE MARKING
AH
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance -- Junction-to-Ambient (surface mounted) Lead Temperature for Soldering, 0.0625 from case Time in Solder Bath Symbol RJA TL Max 83.3 260 10 Unit C/W C Sec
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
Motorola Small-Signal (c) Motorola, Inc. 1996
Transistors, FETs and Diodes Device Data
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BCP53T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristics Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage (IC = -100 Adc, IE = 0) Collector-Emitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) Collector-Emitter Breakdown Voltage (IC = -100 Adc, RBE = 1.0 kohm) Emitter-Base Breakdown Voltage (IE = -10 Adc, IC = 0) Collector-Base Cutoff Current (VCB = - 30 Vdc, IE = 0) Emitter-Base Cutoff Current (VEB = - 5.0 Vdc, IC = 0) V(BR)CBO V(BR)CEO V(BR)CER V(BR)EBO ICBO IEBO -100 - 80 -100 - 5.0 -- -- -- -- -- -- -- -- -- -- -- -- -100 -10 Vdc Vdc Vdc Vdc nAdc Adc
ON CHARACTERISTICS
DC Current Gain (IC = - 5.0 mAdc, VCE = - 2.0 Vdc) (IC = -150 mAdc, VCE = - 2.0 Vdc) (IC = - 500 mAdc, VCE = - 2.0 Vdc) Collector-Emitter Saturation Voltage (IC = - 500 mAdc, IB = - 50 mAdc) Base-Emitter On Voltage (IC = - 500 mAdc, VCE = - 2.0 Vdc) hFE 25 40 25 VCE(sat) VBE(on) -- -- -- -- -- -- -- -- 250 -- - 0.5 -1.0 Vdc Vdc --
DYNAMIC CHARACTERISTICS
Current-Gain -- Bandwidth Product (IC = -10 mAdc, VCE = - 5.0 Vdc, f = 35 MHz) fT -- 50 -- MHz
TYPICAL ELECTRICAL CHARACTERISTICS
f T, CURRENT GAIN BANDWIDTH PRODUCT (MHz) 500 VCE = 2 V hFE , DC CURRENT GAIN 500 300
200
VCE = 2 V 100 50
100
50
20
1
3
5
10 30 50 100 IC, COLLECTOR CURRENT (mA)
300 500
1000
20
1
10 100 IC, COLLECTOR CURRENT (mA)
1000
Figure 1. DC Current Gain
1 120 110 100 90 80 70 60 50 40 30 20 10 0 0
Figure 2. Current Gain Bandwidth Product
0.8 V, VOLTAGE (VOLTS)
0.6
V(BE)on @ VCE = 2 V
C, CAPACITANCE (pF)
V(BE)sat @ IC/IB = 10
Cib
0.4
0.2 V(CE)sat @ IC/IB = 10 0 1 10 100 1000
Cob 2 4 6 8 10 12 14 16 18 20
IC, COLLECTOR CURRENT (mA)
V, VOLTAGE (VOLTS)
Figure 3. Saturation and "ON" Voltages 2
Figure 4. Capacitances Motorola Small-Signal Transistors, FETs and Diodes Device Data
BCP53T1
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
POWER DISSIPATION
The power dissipation of the SOT-223 is a function of the input pad size. These can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SOT-223 package, PD can be calculated as follows. PD = TJ(max) - TA RJA the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 1.5 watts. PD = 150C - 25C 83.3C/W = 1.5 watts
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into
The 83.3C/W for the SOT-223 package assumes the recommended collector pad area of 965 sq. mils on a glass epoxy printed circuit board to achieve a power dissipation of 1.5 watts. If space is at a premium, a more realistic approach is to use the device at a PD of 833 mW using the footprint shown. Using a board material such as Thermal Clad, a power dissipation of 1.6 watts can be achieved using the same footprint.
MOUNTING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5C or less. 260C for more than 10 seconds.
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.15 3.8 0.079 2.0
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.248 6.3 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5
inches mm
0.091 2.3
SOT-223
Motorola Small-Signal Transistors, FETs and Diodes Device Data
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BCP53T1
PACKAGE DIMENSIONS
A F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
4
S
1 2 3
B
D L G J C 0.08 (0003) H M K
BASE COLLECTOR EMITTER COLLECTOR
CASE 318E-04 ISSUE H TO-261AA
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315
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BCP53T1/D Motorola Small-Signal Transistors, FETs and Diodes Device Data

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